This article is about components used to cool devices that generate high temperatures. For other uses, see Heat sink (disambiguation)
Figure 1: A fan-cooled heat sink on the processor of a personal computer. To the right is a smaller heat sink cooling another integrated circuit of the motherboard.
In electronic systems, a heat sink is a passive component that
cools a device by dissipating heat into the surrounding air. Heat sinks
are used to cool electronic components such as high-power semiconductor
devices, and optoelectronic devices such as higher-power lasers and
light emitting diodes (LEDs). Heat sinks are heat exchangers such as those used in refrigeration and air conditioning systems, or the radiator in an automobile.
A heat sink is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. Approach air velocity, choice of material, fin (or other protrusion) design and surface treatment are some of the factors which affect the thermal performance of a heat sink. Heat sinks are used to cool computer central processing units or graphics processors. Heat sink attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit. Thermal adhesive or thermal grease fills the air gap between the heat sink and device to improve its thermal performance.
A heat sink is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. Approach air velocity, choice of material, fin (or other protrusion) design and surface treatment are some of the factors which affect the thermal performance of a heat sink. Heat sinks are used to cool computer central processing units or graphics processors. Heat sink attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit. Thermal adhesive or thermal grease fills the air gap between the heat sink and device to improve its thermal performance.
